Via in Pad

When it comes to Vias, it’s known to us all that Vias can be divided into Through-hole Vias, Blind Vias and Buried Vias. They have different functions.


With the development of the electronic products, Vias play a vital role in the interconnection between layers in a printed circuit board.


Lead to higher density PCBs and promote space savings;

Share a flat surface with component accessories;

Reduce PCB area and further improve wiring;


Therefore, if your project involves vias and you can not choose which type, please contact our engineers for the best solution.


With the reliable Via filling/capping process, Via-in-Pad technology can be used to produce high-density PCB designs without the use of chemical enclosures, avoiding soldering errors. In addition, this can provide the BGA with additional conductor traces.


If your vias are left open, solder will tend to wick down into the via hole. The larger the diameter, the worse the wicking problem can be. You might end up without enough solder left to secure the component, or even a solder bump on the bottom side of the board which could interfere with other components or lead to shorts.

If your vias are capped or partially filled, the caps might pop off due to thermal expansion or out-gassing. Internal air bubbles can migrate up, leading to voids in your solder joint.


We use this technology for many years now and know how to ensure a reliable and safe production process.